E3 Electronics Devices, Circuits and
Technology
E3 214 (JAN) 3:0
Microsensor Technologies
Micro-sensors and
micro-actuators, MEMS and MOEMS; classification and characteristics.
Principles of microsensors –
micromechanics, electro-mechanical coupling, electromagnetics,
opto-mechanical effects, thermal and fluidic
properties, modeling and simulation. Technology
– lithography, deposition, diffusion, metallization,
bulk and surface micro-maching. Commercial
fabrication processes, pressure, vibration, acceleration, rotation,
temperature, magnetic field, radiation, chemical and bio microsensors.
Surface acoustic wave microsensors.
Mciro-opto-electro-mechanical sensors; fiber optic
sensors, smart structures, sensors arrays and distributed sensing, noise in microsensors, control and signal processing, automotive,
aerospace, industrial, and biomedical applications.
T
Srinivas/T Badarinarayana
Raichoudhury,
P. (Ed.), MEMS and MOEMS: Technology and Applications, SPIE Press, 2000.
Current
literature: Special issues of journals and selected review articles
E3- 222
(JAN) 2:1
Micromachining for MEMS Technology
Micromachining
Concepts, Benefits and Materials.
Surface Micromachining and Related Technologies. Bulk Micromachining. Micromachining for high aspect ratio
microstructures. Monolithic Integration
of micromachined mechanical devices and Microelectronics circuits: merits and
complexities.
Laboratory
classes to gain hands on experience on the Micromachining and related
Technology.
Navakanta
Bhat and K N Bhat
Chang
Liu, Foundations of MEMS, Illinois, ECE Series), Pearson Edu Intl, 2006.
Lovacs,
T.A.G., Micromachined Transducers Source Book,
WCB McGraw Hill, NY, Singapore, 1998.
E3 225 (AUG) 3:0
Submicron device modeling and simulation
Band theory of solids, carrier transport mechanism, superconductor,
dielectrics, semiconductor diode, MOS capacitor, MOSFET device physics, EKV
model, circuit simulation techniques, SPICE, CMOS scaling, Moore’s law.
Santanu Mahapatra
Yaun Taur, Tak
H. Ning, Fundamentals of Modern VLSI Devices,
Cambridge University Press, 1998.
Current literature from journals and conference proceedings.
Prerequisite: Basic physics and mathematics Syllabus.
E3 227 (JAN) 2:1
VLSI Device and Process Simulation
Introduction to Device and Process CAD, hierarchy of VLSI simulation
tools, formulation of device and process equations. Numerical techniques, discretization and difference equations. Models for device
simulation: Drift-diffusion, hydrodynamic, thermodynamic, Monte-Carlo technique.
Models for process simulation: Ion implantation, diffusion, vacancy and
interstitial model, TED, OED. Concentration dependent diffusion, ultra shallow
junctions, oxidation, LOCOS and trench isolation. Design and simulation for 0.1
micron technology, SPICE circuit parameter extraction. Statistical process and
device simulation, inverse modeling, mixed mode device and circuit simulation,
radiation effects and single event upset. Advanced transistor design and
simulation: SOI transistor, elevated source/drain transistor, thin film
transistor.
Navakanta Bhat
Prerequisite: E3-225
Plummer, J.D., Deal, M.D., and Griffies,
P.B., Silicon VLSI Technology, Prentice
Hall, 2000.
Dutton, R.W., and Yu, Z., Technology CAD – Computer Simulation of IC
Processes and Devices, Kluwer Academic Publishers,
1993.
ISE TCAD Manuals Release 6.0, 1999.
Current literature from journals and conference proceedings
Introduction to Digital
design, hierarchical design, controller (FSM), case study, FSM issues, timing
issues, pipelining, resource sharing, metastability,
synchronization, MTBF Analysis, setup/hold time of various types of flip-flops,
synchronization between multiple clock domains, reset recovery, proper resets.
VHDL: different models, simulation cycles, process, concurrent and sequential
statements, loops, delay models, library, packages, functions, procedures,
coding for synthesis, test bench. FPGA: logic block and routing architecture,
design methodology, special resources, Virtex-II, Stratix architectures, programming FPGA, constraints, STA,
timing closure, case study.
Kuruvilla Varghese
Wakerly, J.F., Digital Design:
Principles and Practices, Prentice Hall.
Kevin
Skahil, VHDL For Programmable Logic, Addison Wesley.
FPGA
Data sheets, Application Notes.
Current
literature from relevant journals and conference proceedings.
E3 235 (AUG)
2:1
Analog and Data Conversion Systems
Linear IC applications, design and error budget analysis of signal
conditioners for low level AC and DC applications, 4-20 ma current
transmitters, design of linear power supplies, designing for single supply low
power consuming circuits, design of analog circuits for capacitive and
inductive transducers, Analog to digital and digital to analog converters, SHA
and analog multiplexers.
M K Gunasekaran
Franco, S., Design with Operational Amplifiers and Analog Integrated
Circuits, McGraw Hill Book Co. 1988.
Horowitz, P., and Hill, W., The Art of Electronics, Second Edn, Cambridge University Press, 1992.
E3 238 (JAN) 2:1
Analog VLSI Circuits
Introduction to CMOS analog circuits, MOS transistor DC and AC small
signal parameters from large signal model, common source amplifier with
resistive load, diode load and current source load, source follower, common
gate amplifier, cascode amplifier, folded cascode, frequency response of amplifiers. Current
source/sink/mirror, matching. Wilson current source and Regulated cascode current source,
Bandgap reference, Differential amplifier,
Gilbert cell, Op-Amp, Design of 2 stage Op-Amp, DC and AC response, frequency
compensation, slew rate, offset effects, PSRR, noise, comparator, sense
Amplifier, sample and hold, sampled data circuits, switched capacitor filters,
DAC, ADC, Subthreshold CMOS circuits.
Navakanta Bhat, Bharadwaj Amrutur, Gaurab Banerjee
Razavi, B., Design of Analog CMOS Integrated Circuits, McGraw Hill, 2001.
Razavi, B., RF Microelectronics, Prentice Hall, 1998.
Baker, R.J., and Boycee,
D.E., CMOS; Circuit Design, Layout and Simulation, Prentice Hall India, 2000.
E3 238 (AUG) 2:1
Analog VLSI Circuits
Introduction to CMOS analog circuits, MOS transistor DC and AC small
signal parameters from large signal model, common source amplifier with
resistive load, diode load and current source load, source follower, common
gate amplifier, cascode amplifier, folded cascode, frequency response of amplifiers, current
source/sink/mirror, matching, Wilson current source and regulated cascode current source, bandgap
reference, differential amplifier, Gilbert cell, op-amp, design of 2 stage
op-amp, DC and AC response, frequency compensation, slew rate, offset effects,
PSRR, noise, comparator, sense amplifier, sample and hold, sampled data
circuits, switched capacitor filters, DAC, ADC, subthreshold
CMOS circuits.
Navakanta Bhat
Razavi, B., Design of Analog CMOS Integrated Circuits, McGraw Hill, 2001.
Razavi, B., RF Microelectronics, Prentice Hall, 1998.
Baker, R.J., and Boycee,
D.E., CMOS; Circuit Design, Layout and Simulation, Prentice Hall India, 2000.
E3 239 (JAN) 2:1
Advanced VLSI Circuits
Dynamic circuit design, memories, TCAM, Multipliers, adders I/O
circuits, timing control loops, power supply and clock distribution, sub
threshold circuit design, low power circuit design.
Bharadwaj Amrutur
References?
E3 252 (JAN) 2:1
Digital Controllers for Power Applications
Review of analog and digital electronics, operational amplifiers, D/A
and A/D converters, semiconductor memories. Sampling of continuous-time
signals, anti aliasing filter, discrete-time systems, digital systems, finite
state machines. Arithmetic for computers, fixed-point and floating-point and
numbers, digital circuits for fixed-point and floating-point arithmetics. Architecture, features and instruction set of
a specific DSP processor; assemble programming; development tools. Interfacing
examples.
Hands-on exercises – data acquisition, control of power electronic
converters and motor drives, digital techniques in power systems measurement
and protection; mini-project.
G Narayanan and U J Shenoy
Sedra, A.S., and Smith, K.C., Microelectronic Circuits, Fifth
Edn, Oxford University Press.
Astrom, K.J., and Wittenmark, B.,
Computer-controlled systems: Theory and design, Prentice Hall, 1996.
Hintz, K., and Tabak, D., Microcontrollers:
Architecture, Implementation and Programming, McGraw Hill, 1992.
Patterson, D.A., and Hennnessy, J.L.,
Computer organization and design: The hardware/software interface, Third Edn, Elsevier.
Technical datasheets, user guides and application notes from
manufacturers.
E3 253 (JAN) 2:1
Industrial Instrumentation
Measurement of force, displacement, torque, velocity, conductivity and
temperature. Electromagnetic and ultrasonic flow meters. PID and programmable
logic controllers. Case studies of temperature controllers and PC based data
acquisition system.
C Rameshu
Dally, J.W., et al., Instrumentation for Engineering Measurements, John
Wiley and Sons, 1984.
Bently, J.P., Principles of Measurements Systems, Longman
Inc, NY, 1983.
Petruzella, F.D., Programmable Logic Controllers, McGraw Hill, NY,
1989.
E3 255 (JAN) 2:1
Multicore Architecture and
Programming
Multicore architecture, programming multicore
machines, IA32 architecture, microarchitecture,
protected mode, visual memory management, call gates, multitasking, interrupt
processing. Special processing units, program optimization.
H
Intel Manuals on IA32, Multicore and VTUNE.
E3 257 (JAN) 2:1
Embedded Systems - II
Introduction to
embedded computing, introduction to RISC architecture, Introduction to embedded
software development, S/W Development environment – Cross Compiler, Linker, Debugger,
Stand-alone systems. Introduction to ARM architecture and ARM/THUMB instruction
set, Introduction to DSP, Memories, Interfacing memory with processor, Peripherals,
Clocks and Power Management.
Haresh Dagale
Patterson, D.A., and Hennessy, J.L., The Programming Environment for
32-Bit Microprocessors, Freescale Semiconductor
Computer Organization and Design Sixth Edn, The
Hardware/Software Interface.
Hennessy, J.L., and Patterson, D.A., Computer Architecture: A
Quantitative Approach (Publisher?).
Computer Systems: A Programmer’s Perspective by Randal E.
Bryant David R. O’Hallaron
ARM System-on-Chip Architecture (2nd Edition] by Steve Furber MPC860/ MPC8260 User’s Manual, Freescale
Semiconductor (Not clear)
E3 259 (JAN) 2:1
DSP Algorithms and Architectures
Introduction to generic DSPs, performance and structural limitations.
Measures and structures for enhancing performance. Filter structures, transform
structures. Data flow and control flow issues. Array processing approaches to
DSP solutions. Some modern DSP algorithms (audio, video and multimedia) and
development of new computational and arithmetic building blocks. Architecture
development for some compression and coding algorithms. Reference to some
standards and development of architecture based implementation of these.
H
Parhi, K.K., VISI Signal Processing Systems, John Wiley and
Sons, NY, 1999.
Prissch, P., Architectures for Digital Signal Processing,
John Wiley and Sons, NY, 1998.
Sayood, K., Introduction to Data Compression, 2E, Harcourt
India, New Delhi, 2000.
Some Relevant /TU and Other Standards, 1998–2000.
E3 260 (AUG) 2:1
Embedded System Design - II
Software components: startup code, boot loader, kernel, applications.
Embedded system without an os. Real-time kernel: introduction to a real-time kernel,
comparison and contrast with the general purpose as multi-tasking, scheduling
policies, mutual exclusion and synchronization, inter-task control flow,
inter-task data flow, memory management, interrupt processing. Linux for
embedded applications: overview of Linux kernel architecture; system call
interface; process management; memory management; file system structure; Linux
for micro-controllers and real-time applications. Device drivers: character,
block and network drivers. Designing a real-time system: development life
cycle, modeling a real-time system, case studies.
Visiting Faculty
Bryant, R.E., and O’Hallaron, D.R.,
Computer Systems: A Programmer’s Perspective,
Ripps, D.L., An Implementation guide to Real Time
Programming, Yourdon Press.
Rubini, A., and Corbet,
J., Linux Device Drivers, Third Edn.
Bovet, D., and Cesati, M., Understanding
the Linux Kernel, Publishers?
Pre-requisite: E3 257 Embedded Design I
E3 262
(AUG)
2:1
Electronics Systems Packaging
Electronic systems and needs, physical
integration of circuits, packages, boards and full electronic systems, system
applications like computer, automobile, medical and consumer electronics with
case studies, packaging levels. Electrical design considerations – power
distribution, signal integrity and parasitic. RF package design, Power delivery
in systems. CAD for Printed Wiring Boards (PWBs), Design for
Manufacturability (DFM), PWB Technologies, Single-chip (SCM) and
Multi-chip modules (MCM), flex circuits. Recent trends in manufacturing like microvias, sequential build-up circuits and high-density
interconnect structures. Materials and processes in electronics
packaging. Joining methods in electronics: lead-based and lead-free solders,
Surface Mount technology – design, fabrication and assembly. Embedded
Passives, SOC vs SIP vs
SOP concepts, Thermal management of PWBs, thermo-mechanical reliability, design
for reliability and electrical test, Green packaging
issues. Assignments in PCB CAD, Hands-on lab sessions in fabrication
of standard, microvia boards and embedded
passives; assembly of surface mount devices and ball-grid arrays.
Student seminar.
G.V. Mahesh
Tummala, R.R., Fundamentals of Microsystems
Packaging, McGraw Hill, NY, 2001.
Brown, W.D., Advanced Electronic
Packaging, IEEE Press, 1999.
Web-based Current literature.
E3 264 (JAN) 2:1
Industrial Design of Electronic Equipment
Introduction to industrial design. Product design methodology. Product
planning, data collection. Creativity techniques. Elements of aesthetics.
Ergonomics. Control panel organization. Graphic User Interface (GUI) design.
Structure, materials, processes and product finishes. Product detailing.
N V Chalapathi Rao and Guest Faculty
Current Publications in Industrial Design.
E3 265 (JAN) 2:1
Design for Reliability
Review of probability theory. Introduction to the concepts of
reliability, nature of reliability problems in electronic equipment, reliability
modeling, availability and maintainability concepts. Designing for reliability.
Fault analysis techniques. Reliability prediction. Worst case design and
component derating. Software reliability.
Introduction to state space analysis.
L Umanand
Fuqua, Reliability Engineering for Electronic Design, Marcel Dekker,
1988.
Patrick DT O’Connor, Practical Reliability Engineering, John Wiley and
Sons, 1985.
MIL Handbook-338 – Reliability of Electronic Equipment.
E3 266 (JAN) 2:1
Electromagnetic
Compatibility
Signal
and power distribution issues in analog
circuits, use of shielded code, use of instrumentation and Isolation
amplifier for noise reduction
techniques, active noise
cancellation, conducted noise emission in power converters, noise
emission calculations in frequency domain, EMI inducted failure in power
converters. Effect of control coop
stability due to noise. Power and signal
distribution issues in digital circuits,
reflections and cross talk issues in signal integrity. Eye diagram Embedded system design from EMI
point of view, shielding of electronic equipments, ESD issues,
EMC standards and test equipments.
M K Gunasekaran
Ott,
H.W., Noise reduction Techniques in Electronic
Systems. Second Edn, John Wiley Interscience, NY,
1988.
Paul, C.R.,
Introduction to Electromagnetic Compatibility, John Wiley and Sons, 1991.
E3 267 (JAN) 2:1
Microcontroller Applications
Architecture of 8 bit
microcontroller Atmega 32 high level and assembly
language programming, hardware interfacing techniques and their applications.
Hands on experience
with microcontroller kits, design and development of mini projects using
development tools for microcontroller are part of the laboratory exercises.
M
Ayala, K.J., The 8051 Microcontroller, Penram
International.
Peatman, J.B., Design with Microcontrollers, McGraw Hill,1988.
8 bit Embedded Controller Handbook Intel 1989.
16 bit Embedded Controller Handbook Intel 1990.
E3 268 (JAN) 3:0
Advanced CMOS and beyond CMOS
ITRS, problems with short channel devices: SCE, DIBL, leakage,
breakthrough solutions, SOl, high K. metal gate.
non-classical MOSFET, CMOS scaling limit. Emerging nanotechnologies: SET, QCA.
RSQF, RTD.
Santanu Mahapatra
Current literature from journals and conference proceedings
Prerequisite: E3:225
E3 269 (AUG) 0:1
Electronic Circuits
Laboratory
Linear and
nonlinear applications of operational amplifiers, inverting and non-inverting
amplifiers, differential amplifiers, phase-shifting circuits, active filters,
oscillators, comparators waveform generating circuits. Logic circuits, flipflops, counters and timers. Voltage controlled
oscillators, phase locked loops, frequency multiplier and divider circuits.
Electronic circuits relevant for power electronic converters, power systems measurements
and protection of power apparatus.
G Narayanan, U J Shenoy
Horowitz, P., and Hill, W., The art of
electronics, Cambridge University Press, 1989.
Millman, J., and Halkias, C.C.,
Integrated electronics: Analog and digital electronic
circuits and systems, Tata McGraw Hill.
Sedra, A.S., and Smith, K.C., Microelectronic circuits, Fifth
Edn, Oxford University Press.
Technical datasheets and application notes from
manufacturers.
E3-327 (AUG) 2:1
Nanoelectronics Device Fabrication and Characterization
Overview of Nanoelectronics devices
and materials requirement, MOS capacitor
as a building block of FET: Ultrathin
SiO2 growth, High-k dielectrics, Physical Vapour Deposition (PVD),
Metal Organic Chemical Vapour Deposition (MOCVD), Precursor synthesis. Non idealities in MOS structure, metal gate electrodes and work
function engineering. Nanopatterning: Optical photolithography, sub-wavelength
litho-graphy techniques, phase shift lithography.
Resolution Enhancement Techniques, Immersion lithography, Extreme Ultra Violet
(EUV) lithography. Resist trimming, dry etching, Electron beam
lithography. Synthesis of thin film metals,
semiconductors, insulators: Atomic Layer Deposition (ALD), UHCVD, Epitaxy, Molecular Beam Epitaxy
(MBE), Sol Gel process, Self assembly, 1D material – nanotube,
nanowire, nanorod – growth
using CVD, PECVD, Microwave synthesis. Nano MOSFET
performance metrics, non classical transistor structure: Transport in Nano
MOSFET, velocity saturation and overshoot, ballistic transport, Silicon On
Insulator (SOI) – PDSOI and FDSOI, Multigate FET,
metal-semiconductor source/drain junctions, Germanium Nano
MOSFETs, Effect of strain and quantization
on transistor performance, Compound semiconductor MESFETs and MOSFETs, Hetero
structure MOSFETs, Emerging Research
Devices and architectures.
Electrical characterization: HFCV and LFCV, I-V and reliability measurements,
Parameter extraction. Analytical nano-characterization
techniques: thickness measurement using reflectance and Ellipsometry
techniques, micro-stylus step height measurement, AFM, FTIR, XRD, SEM, TEM.
Navakanta Bhat, S A Shivakumar, K N Bhat
International Technology Roadmap for Semiconductors (ITRS)
Current literature from journals and conference proceedings